References cited in this section

35. S.H. Risbud, J.R. Groza, and M.J. Kim, Clean Grain Boundaries in AlN Ceramics Densified without Additives by a Plasma Activated Sintering Process, Philos. Mag., Vol 69, 1994, p 525-533

36. S.J. Hong and P.W. Kao, Reinforced Aluminum Composite Made by Resistance Sintering of Mechanically Alloyed Powders, Mater. Sci. Eng., Vol A119, 1989, p 153-159

37. S.H. Risbud and C.-H. Shan, Resistivity Drops at >240 K and Diamagnetic AC Susceptibility up to 300 K in Rapidly Consolidated YBCO, Mater. Lett., Vol 20, 1994, p 149-153

38. J.A. Schneider, R.S. Mishra, and A.K. Mukherjee, Plasma Activated Sintering of Ceramic Materials, Proc. Second International Symposium on Advanced Synthesis and Processing, Ceramics Transactions, R. Spriggs, Z. Munir, and K. Logan, Ed., 1996, p 143-151

39. R.S. Mishra, S.H. Risbud, and A.K. Mukherjee, Influence of Initial Crystal Structure and Electrical Pulsing on Densification of Nanocrystalline Alumina Powder, J. Mater. Res., Vol 13, 1998, p 86-89

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