References cited in this section

2. R.G. Loasby and P.J. Holmes, Development of Thick Film Technology, Handbook of Thick Film Technology, P.J. Holmes and R.G. Loasby, Ed., Electrochemical Publications, Ltd., 1976, p 5

5. A. Butts and C.D. Coxe, Ed., Silver—Economics, Metallurgy, and Use, Krieger Publishing, 1975, p 441-445

6. J. Savage, Conductor Materials, Handbook of Thick Film Technology, P.J. Holmes and R.G. Loasby, Ed., Electrochemical Publications, Ltd., 1976, p 106

7. T. Kubota, J. Appl. Phys. (Jpn.), Vol 39 (No. 9), 1970, p 861-868

8. F.V. Lenel, Powder Metallurgy Principles and Applications, Metal Powder Industries Federation, 1980, p 39-40

9. T.C. Pluym, Q.H. Powdell, A.S. Gurav, T.L. Ward, T.T. Kodas, L.M. Wang, and H.D. Glicksman, J. AerosolSci, Vol 24 (No. 3), 1993, p 383-392

10. K. Nagashima, Y. Morimitsu, and A. Kato, Nippon Kagaku Kaishi, Vol 12, 1987, p 2293-2300

11. E.M. Jost, K. McNeilly, and T.J. Santala, ISHM '87 Proc., International Society for Hybrid Microelectronics, 1987, p 548-553

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