1351 Fluorescent Ballasts

Miniaturization of electronic ballasts has been made possible by the use of integrated circuits and surface-mount technologies. The new ballasts are smaller, thinner and lighter.

Low Profile Housing

The familiar "brick" shape and weight of ballasts will soon be gone. Reduced parts count and surface mount technology have reduced the size of ballasts as well as improved their reliability. These advances have permitted housings of lower profile and smaller cross-section. Today, some ballasts have a dimensional cross-

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