References cited in this section

14. D.M. Mattox, Particle Bombardment Effects on Thin-Film Deposition: A Review, J. Vac. Sci. Technol. A, Vol 7 (No. 3), 1989, p 1105

15. J.M.E. Harper, J.J. Cuomo, R.J. Gambino, and H.R. Kaufman, Modification of Thin Film Properties by Ion Bombardment during Deposition, Chapter 4, Ion Bombardment Modification of Surfaces—Fundamentals and Applications, O. Aucello and R. Kelly, Elsevier, 1984

16. D.M. Mattox, Adhesion and Surface Preparation, Chapter 3, Deposition Technologies for Films and Coatings, R. Bunshah, Noyes Publications, 1982

17. D.M. Manos and D.L. Flamm, Plasma Etching: An Introduction, Academic Press, 1989

18. H.F. Winters, J.W. Coburn, and T.J. Chuang, Surface Processes in Plasma Assisted Etching Environments, J. Vac. Sci. Technol. B, Vol 1, 1983, p 469

19. D. Mattox, Thin Film Adhesion and Adhesive Failure--A Perspective, Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings, STP 640, ASTM, Feb 1978, p 54

20. J.L. Vossen, J.H. Thomas III, J.-S. Maa, and J.J. O'Neill, Preparation of Surfaces for High Quality Interface Formation, J. Vac. Sci. Technol. A, Vol 2, 1984, p 212

21. L.J. Brillson, Interfacial Chemical Reaction and Diffusion of Thin Metal Films on Semiconductors, Thin Solid Films, Vol 89, 1982, p 461

22. D.J. Sharp and J.K.G. Panitz, Surface Modification by Ion, Chemical and Physical Erosion, Surf. Sci., Vol 118, 1982, p 429

23. A. Leland, K.S. Fancey, and A. Mathews, Plasma Nitriding in a Low Pressure Triode Discharge to Provide Improvements in Adhesion and Load Support for Wear Resistant Coatings, Surf. Eng., Vol 7 (No. 3), 1991, p 207

24. S. Dressler, Single Cycle Plasma Nitriding--TiN Deposition for Alloy Steel Parts, Ind. Heat., Vol 59 (No. 10), 1992, p 38

25. R. Miranda and J.M. Rojo, Influence of Ion Radiation Damage on Surface Reactivity, invited review, Vacuum, Vol 34 (No. 12), 1984, p 1069

26. A. Matthews and D.T. Gethin, Heating Effects in Ionization-Assisted Processes, Thin Solid Films, Vol 117, 1984, p 261

27. A. Matthews, A Predictive Model for Specimen Heating during Ion Plating, Vacuum, Vol 32 (No. 6), 1982, p 311

28. R.T. Johnson, Jr. and D.M. Darsey, Resistive Properties of Indium and Indium-Gallium Contacts to CdS, Solid State Electron., Vol 11, 1968, p 1015

29. K.S. Fancey and J. Beynon, The Front:Back Thickness Ratio of Ion-Plated Films, Vacuum, Vol 34, 1984, p 591

30. K.S. Fancey and A. Mathews, Ion Plating Processes: Design Criteria and System Optimization, Surf. Coat. Technol, Vol 36, 1988, p 233

31. Y. Homma and S. Tsunekawa, Planar Deposition of Aluminum by RF/DC Sputtering with RF Bias, J. Electrochem. Soc., Vol 132, 1985, p 1466

32. C.Y. Ting, V.J. Vivalda, and H.G. Schaefer, Study of Planarized Sputter-Deposited SiO2, J. Vac. Sci. Technol., Vol 15, 1978, p 1105

33. D.W. Skelley and L.A. Gruenke, Significant Improvement in Step Coverage using Bias Sputtered Aluminum, J. Vac. Sci. Technol. A, Vol 4 (No. 3), 1986, p 457

34. J.K.G. Panitz, B.L. Draper, and R.M. Curlee, A Comparison of the Step Coverage of Aluminum Coatings Produced by Two Sputter Magnetron Systems and a Dual Beam Ion System, Thin Solid Films, Vol 166, 1988, p 45

35. R.N. Tait, T. Smy, and M.J. Rett, Simulation and Measurement of Density Variation in Mo Films Sputter Deposited over Oxide Steps, J. Vac. Sci. Technol. A, Vol 8 (No. 3), 1990, p 1593

36. D.M. Mattox, Trans. Soc. Auto. Eng., Vol 78, 1969, p 2175

37. D.M. Mattox, Surface Effects in Reactive Ion Plating, Appl. Surf. Sci., Vol. 48/49, 1991, p 540

38. A. Inspektor, U. Carmi, A. Raveh, Y. Khait, and R. Avni, Deposition of Pyrocarbon in a Low Temperature Environment, J. Vac. Sci. Technol. A, Vol 4 (No. 3 ), 1986, p 375

39. R. Avni, U. Carmi, A. Inspektor, and I. Rosenthal, The Role of Hydrogen in the Radical Polymerization Mechanisms of Hydrocarbon and Chlorosilanes in a Low Pressure Microwave Plasma, J. Vac. Sci. Technol. A, Vol 3 (No. 4), 1985, p 1813

40. W.D. Westwood, Reactive Sputter Deposition, Chapter 9, Handbook of Plasma Processing Technology: Fundamentals, Etching, Deposition and Surface Interactions, S.M. Rossnagel, J.J. Cuomo, and W.D. Westwood, Ed., Noyes Publications, 1990

41. H.F. Winters, J.W. Coburn, and T.J. Chuang, Surface Processes in Plasma Assisted Etching Environments, J. Vac. Sci. Technol. B, Vol 1, 1983, p 469

42. G.A. Lincoln, M.W. Geis, S. Pang, and N. Efremeow, Large Area Ion Beam Assisted Etching of GaAs with High Etch Rates and Controlled Anisotropy, J. Vac. Sci. Technol. B, Vol 1, 1983, p 1043

43. H.P.W. Hey, B.G. Sluijk, and D.G. Hemmes, Ion Bombardment: A Determining Factor in Plasma CVD, Solid State Technol., Vol 33 (No. 4), 1990, p 139

44. L.I. Maissel and P.M. Schaible, Thin Films Formed by Bias Sputtering, J. Appl. Phys., Vol 36, 1965, p 237

45. M. Fukutomi, M. Fujitsuka, and M. Okada, Comparison of the Properties of Ion-Plated Titanium Carbide Films Prepared by Different Activation Methods, Thin Solid Films, Vol 120, 1984, p 283

46. A.J. Aronson, Sputtering Thin-Film Titanium Nitride, Microelectron. Manuf. Test., Vol 11, 1988, p 25

47. K. Ahn, M. Wittmer, and C.Y. Ting, Investigation of TiN Films Reactively Sputtered using a Sputter Gun, Thin Solid Films, Vol 107, 1983, p 45

48. J.M.E. Harper, J.J. Cuomo, and H.T.G. Henzell, Synthesis of Compound Films by Dual Beam Deposition I. Experimental Approach, J. Appl. Phys., Vol 58, 1985, p 550

49. J.J. Cuomo, Synthesis by Reactive Ion Beam Deposition, Conf. Proc., Ion Plating and Implantation: Applications to Materials, R.F. Hochman, Ed., American Society for Metals, 1986

50. J.A. Thornton and D.W. Hoffman, Stress Related Effects in Thin Films, Thin Solid Films, Vol 171, 1989, p 5

51. A.J. Perry, The State of Residual Stress in TiN Films Made by Physical Vapor Deposition Methods: State of the Art, J. Vac. Sci. Technol. A, Vol 8 (No. 3), 1990, p 1351

52. A.J. Perry, A Further Study of the State of Residual Stress in TiN Films Made by Physical Vapor Deposition Methods, J. Vac. Sci. Technol. A, Vol 8 (No. 4), 1990, p 3186

53. D.W. Hoffman and J.A. Thornton, Internal Stresses in Sputtered Chromium, Thin Solid Films, Vol 40, 1977, p 355

54. D.W. Hoffman and M.R. Gaerttner, Modification of Evaporated Chromium by Concurrent Ion Bombardment, J. Vac. Sci. Technol., Vol 17, 1980, p 425

55. D.M. Mattox and R.E. Cuthrell, Residual Stress, Fracture and Adhesion in Sputter-Deposited Molybdenum Films, Symp. Proc., Adhesion in Solids, Vol 119, D.M. Mattox, J.E.E. Baglin, R.E. Gottschall, and C.D. Batich, Ed., Materials Research Society, 1988

56. R.E. Cuthrell, D.M. Mattox, C.R. Peeples, P.L. Dreike, and K.P. Lamppa, Residual Stress Anisotropy, Stress Control and Resistivity in Post Cathode Magnetron Sputter-Deposited Molybdenum Films, J. Vac. Sci. Technol. A, Vol 6 (No. 5), 1988, p 2914

57. D.W. Hoffman and R.C. McCune, Microstructural Control of Plasma-Sputtered Refractory Coatings, Chapter 21, Handbook of Plasma Processing Technology: Fundamentals, Etching, Deposition and Surface Interactions, S.M. Rossnagel, J.J. Cuomo, and W.D. Westwood, Ed., Noyes Publications, 1990, p 483

58. R.D. Bland, G.J. Kominiak, and D.M. Mattox, Effects of Ion Bombardment during Deposition on Thick Metal and Ceramic Deposits, J. Vac. Sci. Technol., Vol 11, 1974, p 671

59. C.V. Macchioni, Mechanical Properties of High Deposition Rate SiO2 Films, J. Vac. Sci. Technol. A, Vol 8 (No. 3), 1990, p 1340

60. S. Benhenda, J.M. Guglielmacci, M. Gillet, L. Hultman, and J.-E. Sundgren, Effect of Substrate Bias on the Protective Properties of TiN Films Grown by Reactive Magnetron Sputtering onto Copper Substrates, Appl. Surf. Sci., Vol 40, 1989, p 121

61. H.K. Pulker, Ion Plating as an Industrial Manufacturing Method, J. Vac. Sci. Technol. A, Vol 10 (No. 4), 1992, p 1669

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