References cited in this section

16. K. Minten and J. Toth, Paper B 5/2, Proc. Printed Circuit World Convention V (Glasgow, Scotland), 1990; Circuit World, Vol 17, 1991, p 19

24. C.A. Deckert, IPC-TP-699, Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, 1988

64. H.-J. Grapentin and J. Wolff, Galvanotechnik, Vol 70, 1979, p 958

66. MIL-P-55110D, U.S. Government Printing Office

67. D3359-78B, ASTM

68. C. Lea et al, Circuit World, Vol 11 (No. 3), 1985, p 5; Vol 12 (No. 4), 1986, p 14, 20, 26; Vol 13 (No. 1), 1986, p 28, 43

0 0

Post a comment