References cited in this section

13. D.M. Mattox, Surface Effects in Reactive Ion Plating, Appl. Surf Sci., Vol 48/49, 1991, p 540, and references therein

18. J.E. Greene, T. Motooka, J.-E. Sundgren, D. Lubbens, S. Gorbatkin, and S.A. Barnett, The Role of Ion/Surface Interactions and Photo-Induced Reactions during Film Growth from the Vapor Phase, Nucl. Instrum. Methods Phys. Res. B, Vol 27, 1987, p 226, and references therein

22. S. Veprek and M. Heintz, The Mechanism of Plasma-Induced Deposition of Amorphous Silicon from Silane, Plasma Chem. Plasma Process., Vol 10 (No. 1), 1990, p 3

40. W.D. Westwood, Reactive Sputter Deposition, Chapter 9, Handbook of Plasma Processing Technology: Fundamentals, Etching, Deposition and Surface Interactions, S.M. Rossnagel, J.J. Cuomo, and W.D. Westwood, Noyes Publications, 1990, p 233

41. A.O. Klimovskii, A.V. Bavin, V.S. Tkalich, and A.A. Lisachenko, Interaction of Ozone with Gamma-Al2O3 Surface, React. Kinet. Catal. Lett., Vol 23 (No. 1-2), 1983, p 95-98 (trans. from Russian)

42. P.A. Dowben, A Review of the Halogen Adsorption Process on Metal Surfaces, Crit. Rev. Solid State Mater. Sci., Vol 13 (No. 3), 1987, p 191

43. J.E. Greene and S.A. Barnett, Ion-Surface Interactions during Vapor Phase Crystal Growth by Sputtering, MBE and Plasma-Enhanced CVD: Applications to Semiconductors: Critical Review, J. Vac. Sci. Technol., Vol 21 (No. 2), 1982, p 285

44. G.A. Lincoln, M.W. Geis, S. Pang, and N. Efremow, Large Area Ion Beam Assisted Etching of GaAs with High Etch Rates and Controlled Anisotropy, J. Vac. Sci. Technol. B, Vol 1, 1983, p 1043

45. S. Schiller, U. Heisig, and K. Goedicke, Alternating Ion Plating--A Method of High Rate Ion Vapor Deposition, J. Vac. Sci. Technol., Vol 12 (No. 4), 1975, p 858

46. J.M.E. Harper, J.J. Cuomo, and H.T.G. Hentzell, Quantitative Ion Beam Process for the Deposition of Compound Thin Films, Appl. Phys. Lett., Vol 43, 1983, p 547

47. J.D. Speight and M.J. Bill, Observations on the Aging of Ti-Based Metallizations in Air/HCl Environments, Thin Solid Films, Vol 15, 1973, p 325

48. D.J. Sharp, Corrosion Inhibition in Sputter-Deposited Thin-Film Systems using an Intermediary Layer of Palladium, J. Vac. Sci. Technol., Vol 16 (No. 2), 1979, p 204

49. B.V. Movchan, Composite Materials Deposited from the Vapour Phase under Vacuum, Surf. Coat. Technol., Vol 46 (No. 1), 1991, p 1

50. S. Thomas and H.M. Berg, Micro-Corrosion of Al-Cu Bonding Pads, IEEE/IRPS, 1985, p 153

51. H. Biedwermann and L. Martinu, Plasma Polymer-Metal Composite Films, Chapter 4, Plasma Deposition, Treatment and Etching of Polymers, R. d'Agostino, Ed., Academic Press, 1990

52. L.R. Testardi, W.A. Royer, D.D. Bacon, A.R. Storm, and J.H. Wernick, Exceptional Hardness and Corrosion Resistance of Mo5Ru3 and W3Ru2 Films, Metall. Trans., Vol 4, 1973, p 2195

53. L. Brewer, A Most Striking Confirmation of the Engel Metallic Correlation, Acta Metall., Vol 15, 1967, p 553

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