References cited in this section

54. F.G. Yost, D.E. Amos, and A.D. Romig, Stress Driven Diffusion Voiding of Aluminum Conductor Lines, Proc. IEEE/IRPS '89, 1989, p 193

55. G.J. Kominiak and D.M. Mattox, Physical Properties of Thick Sputter-Deposited Glass Films, J. Electrochem. Soc., Vol 120, 1973, p 1535

56. J.W. Patten, E.D. McClanahan, and J.W. Johnson, Room-Temperature Recrystallization in Thick Bias-Sputtered Copper Deposits, J. Appl. Phys., Vol 42, 1971, p 4371

57. R.R. Zito, W.S. Bickel, and W.M. Bailey, The Physical and Optical Properties of Agglomerated Gold Films, Thin Solid Films, Vol 114, 1984, p 241

58. Y.-K. Chao, S.K. Kurinec, I. Toor, H. Shillingford, and P H. Holloway, Porosity in Thin Ni/Au Metallization Layers, J. Vac. Sci. Technol. A, Vol 5, 1987, p 337

59. M.-A. Nicolet, Diffusion Barriers in Thin Films, Thin Solid Films, Vol 52, 1978, p 415

60. J.E.E. Baglin, Ion Beam Effects on Thin Film Adhesion, Chapter 15, Ion Beam Modification of Insulators, P. Mazzoldi and G. Arnold, Ed., Elsevier, 1987

61. A.T. English and P.A. Turner, Use of Vibratory Finishing for Occlusion of Pinholes and for Surface Smoothing in Thin Films on Ceramic Substrates, Plating, Sept 1972, p 851

62. J.K.G. Panitz, D.J. Sharp, and F.E. Martinez, Electrophoretic Coatings for Capacitor Applications, Plat. Surf. Finish, Vol 75, 1988, p 23

0 0

Post a comment