ELECTROLESS NICKEL PLATING is used to deposit nickel without the use of an electric current. The coating is deposited by an autocatalytic chemical reduction of nickel ions by hypophosphite, aminoborane, or borohydride compounds. Two other methods have been used commercially for plating nickel without electric current, including (1) immersion plating on steel from solutions of nickel chloride and boric acid at 70 °C (160 °F) and (2) decomposition of nickel carbonyl vapor at 180 °C (360 °F). Immersion deposits, however, are poorly adherent and nonprotective, while the decomposition of nickel carbonyl is expensive and hazardous. Accordingly, only electroless nickel plating has gained wide acceptance.

Since gaining commercial use in the 1950s, electroless nickel plating has grown rapidly and now is an established industrial process. Currently, hot acid hypophosphite-reduced baths are most frequently used to plate steel and other metals, whereas warm alkaline hypophosphite baths are used for plating plastics and nonmetals. Borohydride-reduced baths are also used to plate iron and copper alloys, especially in Europe.

Electroless nickel is an engineering coating, normally used because of excellent corrosion and wear resistance. Electroless nickel coatings are also frequently applied on aluminum to provide a solderable surface and are used with molds and dies to improve lubricity and part release. Because of these properties, electroless nickel coatings have found many applications, including those in petroleum, chemicals, plastics, optics, printing, mining, aerospace, nuclear, automotive, electronics, computers, textiles, paper, and food machinery (Ref 1). Some advantages and limitations of electroless nickel coatings include:


• Good resistance to corrosion and wear

• Excellent uniformity

• Solderability and brazeability


• Higher chemical cost than electroplating

• Brittleness

• Poor welding characteristics due to contamination of nickel plate with nickel phosphorus deposits

• Need to copper strike plate alloys containing significant amounts of lead, tin, cadmium, and zinc before electroless nickel can be applied

• Slower plating rate, as compared to electrolytic methods

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