Low Temperature CoFired Ceramic Chip Carriers

JOHN U. KNICKERBOCKER and SARAH H. KNICKERBOCKER

IBM, Inc., 208 Creamery Road, Hopewell Junction, NY 12533

4.1 Introduction and Background

4.2 Market Applications

4.3 Materials

4.3.1 Materials Characteristics

4.3.1.1 Interconnect Substrate Materials Selection

4.3.1.2 Cordierite Composition Optimization

4.3.2 Dielectric and Conductor Compatibility

4.4 Low-Temperature Multilayer Ceramic (MLC) Processing

4.4.1 Raw Materials Preparation and Casting

4.4.2 Green Sheet Punching, Metallization, and Inspection

4.4.3 Stacking, Lamination, and Green Sizing

4.4.4 Sintering

4.4.5 Postsinter Finish Metallization

4.4.6 Test and Inspection

4.5 Mechanical and Thermal Properties

4.6 Integral Passives

4.6.1 Advantages and Limitations of Integral Passives

4.6.1.1 Resistors

4.6.1.2 Capacitors

4.6.1.3 Other Applications

4.7 Products Applications Future Trends

4.8 Summary References

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